METHOD OF ASSEMBLY OF A SEMICONDUCTOR PACKAGE FOR THE IMPROVEMENT OF THE ELECTRICAL TESTING YIELD ON THE PACKAGES SO OBTAINED

摘要

A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.