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Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas

机译:生产混合堆叠结构,不同绝缘区域和/或局部垂直导电区域的方法

摘要

The invention relates to a method for producing a semiconducting structure including:controlled formation, through a mask (31), in a first substrate (30) in a semiconducting material, of at least one first area in an insulating material (36), up to the level of the lower surface (35) of the mask, before or during the removal of the mask.
机译:本发明涉及一种用于制造半导体结构的方法,该方法包括: 通过掩模( 31 )在半导体材料的第一基板( 30 )中控制形成至少一个第一区域,绝缘材料( 36 ),在去除掩模之前或过程中直至掩模的下表面( 35 )的水平。

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