首页> 外国专利> BASE PLATFORMS WITH COMBINED ASIC AND FPGA FEATURES AND PROCESS OF USING THE SAME

BASE PLATFORMS WITH COMBINED ASIC AND FPGA FEATURES AND PROCESS OF USING THE SAME

机译:结合了ASIC和FPGA功能的基本平台以及使用相同功能的过程

摘要

A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.
机译:公开了一种用于配置具有ASIC和FPGA模块的基本平台以执行多种功能的过程。映射并验证了电路的经过验证的RTL硬件描述,以标识存储器可编程功能。存储器可编程功能被分组以分配给FPGA模块。非存储器可编程功能被合成到ASIC模块,而存储器可编程功能被合成到FPGA模块。布局,信号路由和边界时序收敛完成,并通过添加金属化层来配置ASIC模块并创建固件存储器来配置FPGA模块来配置平台。 FPGA模块中的超额配置功能允许在制造后更改逻辑功能。

著录项

  • 公开/公告号US2010031222A1

    专利类型

  • 公开/公告日2010-02-04

    原文格式PDF

  • 申请/专利权人 GARY S. DELP;GEORGE WAYNE NATION;

    申请/专利号US20090576775

  • 发明设计人 GARY S. DELP;GEORGE WAYNE NATION;

    申请日2009-10-09

  • 分类号G06F17/50;H03K19/173;

  • 国家 US

  • 入库时间 2022-08-21 18:50:31

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