首页>
外国专利>
Semiconductor package having die with recess and discrete component embedded within the recess
Semiconductor package having die with recess and discrete component embedded within the recess
展开▼
机译:半导体封装,具有裸片,该裸片具有凹槽,并且分立元件嵌入该凹槽中
展开▼
页面导航
摘要
著录项
相似文献
摘要
A semiconductor package includes a substrate having contacts, and a discrete component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a die attach polymer attaching the die to the substrate. The die includes a recess, and the discrete component is contained in the recess encapsulated in the die attach polymer. A method for fabricating the package includes the steps of: attaching the discrete component to the substrate, placing the die attach polymer on the discrete component and the substrate, pressing the die into the die attach polymer to encapsulate the discrete component in the recess and attach the die to the substrate, and then placing the die in electrical communication with the discrete component. An electronic system includes the semiconductor package mounted to a system substrate.
展开▼