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Method for testing the leakage rate of vacuum encapsulated devices

机译:真空封装装置泄漏率的测试方法

摘要

The present invention is directed to a method for testing the leakage rate of an encapsulated device comprising the step: bombing the device with a neon and/or argon atmosphere using a bombing pressure of at least more than environmental pressure and measuring the quality factor before and after bombing. Preferably, the bombing time is about 10 to 100 hours, and the bombing pressure is 1.5 to 100 bar, more preferably 1.5 to 5 bar and most preferably about 4 bar. With this test, the leakage rate of fine leaks of the device may be determined.
机译:本发明涉及一种用于测试封装的设备的泄漏率的方法,该方法包括以下步骤:使用至少大于环境压力的轰击压力,在氖气和/或氩气气氛下轰击该设备,并在之前和之后测量品质因数。轰炸后优选地,轰击时间为约10至100小时,轰炸压力为1.5至100巴,更优选为1.5至5巴,最优选为约4巴。通过该测试,可以确定设备的细小泄漏的泄漏率。

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