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Stencil masks, method of manufacturing stencil masks, and method of using stencil masks

机译:模板掩膜,模板掩膜的制造方法以及模板掩膜的使用方法

摘要

The present invention presents a stencil mask in which various surface patterns can be formed, and in which deformation is suppressed when charged particles are introduced. A stencil mask of the present invention is provided with a semiconductor stack. A first penetrating hole corresponding to an ion introducing area is formed in a first semiconductor layer of the semiconductor stack, and second penetrating holes are formed in a second semiconductor layer, these second penetrating holes having a width greater than the width of the first penetrating hole. The first penetrating hole and the second penetrating holes communicate and pass through the semiconductor stack. Beam members extending between adjacent second penetrating holes connect portions of the first semiconductor layer separated by the first penetrating hole.
机译:本发明提供一种模版掩模,其中可以形成各种表面图案,并且在引入带电粒子时可以抑制变形。本发明的模板掩模具有半导体叠层。在半导体叠层的第一半导体层中形成有与离子导入区域对应的第一贯穿孔,在第二半导体层中形成有第二贯穿孔,这些第二贯穿孔的宽度大于第一贯穿孔的宽度。 。第一穿透孔和第二穿透孔连通并穿过半导体叠层。在相邻的第二贯通孔之间延伸的梁构件连接第一半导体层的被第一贯通孔隔开的部分。

著录项

  • 公开/公告号US7824825B2

    专利类型

  • 公开/公告日2010-11-02

    原文格式PDF

  • 申请/专利权人 TSUYOSHI NISHIWAKI;HIDEKI TOJIMA;

    申请/专利号US20060496552

  • 发明设计人 TSUYOSHI NISHIWAKI;HIDEKI TOJIMA;

    申请日2006-08-01

  • 分类号G03F1/00;G03F7/20;G21K5/04;

  • 国家 US

  • 入库时间 2022-08-21 18:50:01

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