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Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory
Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory
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机译:用于提高晶片回收工厂中进出晶片检查生产率的设备
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摘要
An apparatus and method for inspecting wafers at a reclaim factory is described. Embodiments of the invention describe an apparatus in which a wafer ID and wafer thickness may be simultaneously measured. A wafer is placed onto a sloped surface and positioned by aligning a notch in the wafer with a pin located on the surface, and by propping the wafer against a pair of laterally opposite restraints. In one embodiment, a foot-switch is used to trigger the simultaneous wafer ID and wafer thickness measurements.
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