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Heusler alloy with insertion layer to reduce the ordering temperature for CPP, TMR, MRAM, and other spintronics applications

机译:带有插入层的Heusler合金可降低CPP,TMR,MRAM和其他自旋电子应用的订购温度

摘要

A spin valve structure is disclosed in which an AP1 layer and/or free layer are made of a laminated Heusler alloy having Al or FeCo insertion layers. The ordering temperature of a Heusler alloy such as Co2MnSi is thereby lowered from about 350° C. to 280° C. which becomes practical for spintronics device applications. The insertion layer is 0.5 to 5 Angstroms thick and may also be Sn, Ge, Ga, Sb, or Cr. The AP1 layer or free layer can contain one or two additional FeCo layers to give a configuration represented by FeCo/[HA/IL]nHA, [HA/IL]nHA/FeCo, or FeCo/[HA/IL]nHA/FeCo where n is an integer ≧1, HA is a Heusler alloy layer, and IL is an insertion layer. Optionally, a Heusler alloy insertion scheme is possible by doping Al or FeCo in the HA layer. For example, Co2MnSi may be co-sputtered with an Al or FeCo target or with a Co2MnAl or Co2FeSi target.
机译:公开了一种旋转阀结构,其中,AP1层和/或自由层由具有Al或FeCo插入层的层叠的赫斯勒合金制成。从而将诸如Co 2 MnSi之类的赫斯勒合金的有序温度从约350℃降低到280℃,这对于自旋电子器件应用变得可行。插入层的厚度为0.5至5埃,也可以为Sn,Ge,Ga,Sb或Cr。 AP1层或自由层可以包含一个或两个附加的FeCo层,以提供由FeCo / [HA / IL] n HA,[HA / IL] n 表示的配置HA / FeCo或FeCo / [HA / IL] n HA / FeCo,其中n为≥1的整数,HA为Heusler合金层,IL为插入层。可选地,通过在HA层中掺杂Al或FeCo,可以实现Heusler合金插入方案。例如,Co 2 MnSi可以与Al或FeCo靶或Co 2 MnAl或Co 2 FeSi靶进行共溅射。

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