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Real-time fault detection and classification system in use with a semiconductor fabrication process

机译:与半导体制造过程一起使用的实时故障检测和分类系统

摘要

A real-time fault detection and classification (FDC) system, which is in use with a semiconductor fabrication process having a first sub-fabrication process and a second sub-fabrication process, includes a computer integrated manufacturing (CIM) host adopting a SEMI equipment communication standard (SECS), a semiconductor tool for executing the first sub-fabrication process and generating first status data in conformity with the SECS, a non-semiconductor tool for executing the second sub-fabrication process and generating second status data in conformity with a predetermined connectivity standard different from the SECS, and a tool simulator connecting the tool simulator with the semiconductor tool and the non-semiconductor tool for receiving the first and second status data and transforming the second status data into third status data in conformity with the SECS such that the CIM host can classify the first and third status data according to a predetermined classification technique and get a control over equipment health conditions of the semiconductor tool as well as the non-semiconductor tool.
机译:实时故障检测和分类(FDC)系统与具有第一子制造过程和第二子制造过程的半导体制造过程一起使用,包括采用SEMI设备的计算机集成制造(CIM)主机。通信标准(SECS),用于执行第一子制造工艺并生成符合SECS的第一状态数据的半导体工具,用于执行第二子制造工艺并生成符合SECS的第二状态数据的非半导体工具不同于SECS的预定连接标准,以及工具模拟器,其将工具模拟器与半导体工具和非半导体工具相连接,以接收第一和第二状态数据并将第二状态数据转换为符合SECS的第三状态数据,例如CIM主机可以根据预定的分类技术对第一状态数据和第三状态数据进行分类并可以控制半导体工具和非半导体工具的设备健康状况。

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