COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS

摘要

COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALSABSTRACT Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the the first substrate and the first semiconductor chip.FIG.1