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FABRICATION PROCESS FOR A THICK FILM BY MAGNETRON SPUTTERING
FABRICATION PROCESS FOR A THICK FILM BY MAGNETRON SPUTTERING
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机译:磁控溅射法制备厚膜的工艺
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摘要
Disclosed is a fabrication process for a thick film by magnetron sputtering. The thick film fabrication process comprises: forming, over a substrate, a first thin film having a compressive residual stress using a magnetron sputtering method; forming, over the first thin film, a second thin film having a tensile residual stress using a magnetron sputtering method; repeating the deposition of the first and second thin films at least once to deposit a thin film having an overall residual stress controlled within a predetermined range. With this fabrication process for a thick film, the overall stress of a thick film can be controlled to fall within an allowable range, and a thick film can be made of a homogenous substance as well as heterogeneous substances.
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