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首页> 外文期刊>Surface & Coatings Technology >Multistep magnetron sputtering process and in-situ heat treatment to manufacture thick, fully oxidized and well crystallized YSZ films
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Multistep magnetron sputtering process and in-situ heat treatment to manufacture thick, fully oxidized and well crystallized YSZ films

机译:MultiStep磁控溅射工艺和原位热处理制造厚,完全氧化,结晶良好的YSZ薄膜

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In this work, yttria stabilized zirconia electrolyte layers were deposited by reactive pulsed DC magnetron sputtering on various substrates (i.e. silicon wafer, glass plates, NiO/YSZ cermets). The sputtering process was studied by following the cathode voltage and gas pressure evolutions with the reactive flow rate. The substrate temperature was found to play a role on the transition between the elemental and reactive sputtering modes. The influence of the sputtering parameters and deposition conditions on the film properties was investigated. Thick (about 2 mu m) and dense deposits were manufactured both in elemental and in reactive sputtering modes. Ex-situ and in-situ heat treatments were applied to promote crystallization and oxidization of the deposits. The oxygen content was evaluated by Rutherford backscattering spectroscopy before and after heat treatments which confirmed that fully oxidized material was obtained. Optical transmission measurements on deposits synthesized on glass slides were also performed for a cross check of the oxidation state. X-ray diffraction technique revealed that heating of the substrate is necessary to get a crystallized as-deposited film. However, further annealing is required to synthesize the desired YSZ cubic phase. It has been proved that with the proposed multistep process including in-situ short heating steps, thick YSZ films could be synthesized without any stress cracking as usually observed after complete oxidation. Those films have shown very low leakage rate (6.67 x 10(-4) mbar.l.s(-1)) which is required for the application.
机译:在这项工作中,通过各种基板上的反应性脉冲DC磁控管溅射沉积YtTria稳定的氧化锆电解质层(即硅晶片,玻璃板,NiO / YSZ金属陶瓷)。通过跟随阴极电压和具有反应流速的气体压力演进来研究溅射工艺。发现衬底温度在元素和反应溅射模式之间的过渡中起作用。研究了溅射参数和沉积条件对膜性能的影响。厚(约2μm)和致密的沉积在元素和反应性溅射模式下制造。采用原地和原位热处理以促进沉积物的结晶和氧化。通过Rutherford反向散射光谱法评估氧含量之前和之后的热处理,所述热处理证实得到了完全氧化材料。还对氧化态的交叉检查进行了在玻璃载玻片上合成的沉积物上的光学传输测量。 X射线衍射技术揭示了基板的加热是必需的,得到结晶的沉积膜。然而,需要进一步退火来合成所需的YSZ立方相。已经证明,利用包括原位短加热步骤的提议的多步骤过程,可以在完全氧化后通常观察到的情况下合成厚YSZ薄膜而没有任何应力裂缝。这些薄膜具有施加所需的非常低的泄漏率(6.67×10(-4)mbar.s(-1))。

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