DEVICE AND METHOD FOR TREATING A SUBSTRATE IN THE FIELD OF SEMICONDUCTOR TECHNOLOGY, IN ADDITION TO A SYSTEM COMPRISING A DEVICE FOR TREATING A SUBSTRATE

摘要

The invention relates to a device for treating a substrate (2) comprising a process station (1, 4), wherein a substrate is processed, in addition to an individual substrate handling robot for transporting an individual substrate from the inlet station to the process station and to the outlet station. According to the invention, a buffer station comprising a handling robot, which is used to transport a substrate (2) to the buffer station, is provided. The individual substrate handling robot is configured in such a manner that a substrate can be transported from an inlet station to the process station and from the buffer station to an outlet station. The invention also relates to a method for treating a substrate, in particular with the above-mentioned device, in addition to a system containing the above-mentioned device.