Apparatus and method for treating a substrate in the field of semiconductor technology, as well as the system, including a device for the machining of a substrate

摘要

Device for treating a substrate (2, 3) in the field of semiconductor technology, in particular of a wafer, or a glass plate with a process station (1, 4), wherein a substrate takes place as well as a single substrate - handling robot for the transport of an individual substrate of an input station in the process station (1, 4) and to an exit station, characterized in that a buffer station is provided which, of an auxiliary handling robot (5) for the transport of a substrate (2, 3) exclusively by the process station (1, 4) into the buffer station, and in that the single substrate - handling robot is designed for this purpose, a substrate (2, 3) from the inlet station in the process station and from the buffer station to convey in the exit station.