首页> 外国专利> PHASE-CHANGE MEMORY DEVICE AND A METHOD FOR FABRICATING THE SAME, CAPABLE OF PROTECTING THE EXPOSURE OF A PHASE CHANGE FILM PATTERN FROM A PHYSICAL IMPACT BY HARDENING THE FIRST INSULATING FILM

PHASE-CHANGE MEMORY DEVICE AND A METHOD FOR FABRICATING THE SAME, CAPABLE OF PROTECTING THE EXPOSURE OF A PHASE CHANGE FILM PATTERN FROM A PHYSICAL IMPACT BY HARDENING THE FIRST INSULATING FILM

机译:相变存储器装置及其制造方法,能够通过硬化第一绝缘膜来从物理冲击中保护相变膜图案的暴露

摘要

PURPOSE: A phase-change memory device and a method for fabricating the same are provided to prevent an air gap a domain in which a phase change film pattern is tightly arranged by forming a first insulating film with excellent gap fill.;CONSTITUTION: In a phase-change memory device and a method for fabricating the same, a phase change layer(110) including a phase change material film is formed on a substrate(100). An anti oxidation layer(140) is formed along the surface of the phase change film pattern on the substrate. An inter-layer insulating film(165) is formed on the anti oxidation layer between phase change film patterns. The inter-layer insulating film comprises a first insulating layer(150) and a second insulating layer(160). The first insulating layer has a phase higher than phase change material film, and the first insulating layer has a gap fill superior to the second insulating layer.;COPYRIGHT KIPO 2010
机译:目的:提供一种相变存储器件及其制造方法,以通过形成具有良好间隙填充的第一绝缘膜来防止气隙进入紧紧排列相变膜图案的区域。在相变存储器件及其制造方法中,包括相变材料膜的相变层(110)形成在基板(100)上。在基板上沿着相变膜图案的表面形成抗氧化层(140)。在相变膜图案之间的抗氧化层上形成层间绝缘膜(165)。层间绝缘膜包括第一绝缘层(150)和第二绝缘层(160)。第一绝缘层具有比相变材料膜更高的相,并且第一绝缘层具有优于第二绝缘层的间隙填充。; COPYRIGHT KIPO 2010

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