PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD THEREOF, CAPABLE OF IMPLEMENTING A CIRCUIT LAYER WITH HIGH PRECISION AND IMPLEMENTING HIGH ELECTRICAL CONNECTION WITH AN ELECTRONIC COMPONENT

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a bump with a fine pitch using a conductive paste including a carbon nano tube and a photosensitive binder.;CONSTITUTION: A circuit board main body(10) has a circuit layer conducting an electric signal. A bump(35) is made of a carbon nano tube electrically connected to a circuit layer and a conductive paste including a photosensitive binder. The circuit board main body includes an external connection terminal exposed to the outermost circuit layer. The outermost circuit layer includes an external connection terminal connected to the electronic components. A solder resist layer(13) is coated in the part except the external connection terminal to prevent the corrosion and etching of the outermost circuit layer. The conductive paste includes the metal powder.;COPYRIGHT KIPO 2010