METHOD FOR POLISHING A SUBSTRATE, CAPABLE OF INCREASING THE GROUNDING SPEED WITH A GRINDING PAD AT THE EDGE OF THE SUBSTRATE RELATIVELY

摘要

PURPOSE: A method for polishing a substrate is provided to improve the grounding uniformity of a substrate by increasing the amount of the grounding at the edge of the substrate.;CONSTITUTION: In a method for polishing a substrate, a substrate is ground while rotating a grinding pad(423) to a reverse rotational direction of the substrate. The bottom of the substrate is rotated while being supported by a supporting member. The grounding pad is rotated at a position opposite to the top of the substrate.;COPYRIGHT KIPO 2010