BONDING METHOD OF CERAMICS SUBSTRATE AND A METAL FILM, A LIGHT EMITTING DIODE, AND A METHOD FOR FABRICATING THE SAME, CAPABLE OF INCREASING THE BONDING STRENGTH OF A BOND LAYER

摘要

PURPOSE: A bonding method of ceramics substrate and a metal film, a light emitting diode, and a method for fabricating the same are provided to form a bond layer for separating interface by performing a heat treatment of a paste with an inert gas.;CONSTITUTION: A bonding method of a metal layer and a ceramic substrate comprise three steps: preparation, forming, jointing. The ceramic substrate is prepared in a preparation step. Cu2O layer and a metal layer are formed on the ceramic substrate in a formation step. The ceramic substrate, the Cu2O layer, and the metal layer are processed through a heat treatment so that the ceramic substrate and the metal layer are boned together. A light-emitting diode package comprises a first ceramic substrate(10), a first junction layer(31), a metal layer(50), and a second junction layer(51).;COPYRIGHT KIPO 2010