WAFER LEVEL CHIP SIZE PACKAGE OF A SEMICONDUCTOR DEVICE BY HOLE CONNECTION TO MINIMIZE THE LENGTH OF WIRING AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A wafer level chip size package of a semiconductor device by hole connection and a manufacturing method thereof are provided to prevent light loss and improve the sensitivity of the image sensor and image quality.;CONSTITUTION: A wafer level chip size package of a semiconductor device by hole connection comprises a substrate in which a plurality of semiconductor devices and an electrode pad are formed, a through hole which is formed in contact with the electronic pad on a dicing street, an insulating layer which is formed on the back side of the through hole and the substrate, a metal seed layer which is formed on the back side of the insulating layer and the substrate, a penetrating electrode which is formed on the top of the electrode pad and inside of the through hole, and a bump which is formed in the penetrating electrode.;COPYRIGHT KIPO 2010