首页> 外国专利> CERAMIC CHIP COMPONENT AND A MANUFACTURING METHOD THEREOF, CAPABLE OF IMPROVING SURFACE ROUGHNESS OF AN EXTERNAL ELECTRODE

CERAMIC CHIP COMPONENT AND A MANUFACTURING METHOD THEREOF, CAPABLE OF IMPROVING SURFACE ROUGHNESS OF AN EXTERNAL ELECTRODE

机译:陶瓷芯片成分及其制造方法,能够改善外部电极的表面粗糙度

摘要

PURPOSE: A ceramic chip component and a manufacturing method thereof are provided to improve bonding strength between an external electrode and the metal wire by removing an oxide coating from an external electrode.;CONSTITUTION: A ceramic chip component(100) includes a ceramic substrate(10) and an external electrode(20). The external electrode is formed by performing a thermal process after printing metal paste on one surface of at least one of the upper surface and the lower surface of the ceramic substrate. The external electrode is surface-treated by a physical method to improve smoothness and surface illuminance. The external electrode is surface-treated with one of polishing, ball milling, grinding, and rolling.;COPYRIGHT KIPO 2010
机译:目的:提供一种陶瓷芯片组件及其制造方法,以通过去除外部电极上的氧化物涂层来提高外部电极与金属线之间的结合强度。组成:陶瓷芯片组件(100)包括陶瓷基板( 10)和外部电极(20)。通过在陶瓷基板的上表面和下表面中的至少一个的一个表面上印刷金属膏之后执行热处理来形成外部电极。通过物理方法对外部电极进行表面处理,以改善平滑度和表面照度。外电极经过抛光,球磨,研磨和轧制中的一种进行了表面处理。; COPYRIGHT KIPO 2010

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