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CERAMIC CHIP COMPONENT AND A MANUFACTURING METHOD THEREOF, CAPABLE OF IMPROVING SURFACE ROUGHNESS OF AN EXTERNAL ELECTRODE
CERAMIC CHIP COMPONENT AND A MANUFACTURING METHOD THEREOF, CAPABLE OF IMPROVING SURFACE ROUGHNESS OF AN EXTERNAL ELECTRODE
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机译:陶瓷芯片成分及其制造方法,能够改善外部电极的表面粗糙度
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摘要
PURPOSE: A ceramic chip component and a manufacturing method thereof are provided to improve bonding strength between an external electrode and the metal wire by removing an oxide coating from an external electrode.;CONSTITUTION: A ceramic chip component(100) includes a ceramic substrate(10) and an external electrode(20). The external electrode is formed by performing a thermal process after printing metal paste on one surface of at least one of the upper surface and the lower surface of the ceramic substrate. The external electrode is surface-treated by a physical method to improve smoothness and surface illuminance. The external electrode is surface-treated with one of polishing, ball milling, grinding, and rolling.;COPYRIGHT KIPO 2010
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