SEMICONDUCTOR PACKAGE WHICH CAN IMPROVE BAUD BY INTERLINKING SEMICONDUCTOR PACKAGES AS A CONNECTOR OF A LOW RESISTANCE AND STACKED SEMICONDUCTOR PACKAGES HAVING THE SAME

摘要

PURPOSE: A semiconductor package and a stacked semiconductor packages having the same are provided to improve a connection structure of the wirings. Data is processed at high speed.;CONSTITUTION: A substrate(10) has a substrate body, and the wirings and connectivity patterns. A third region(TR) following the around a second part(SR) and the second part followed is had. The one-side ends of wirings are expended as the third region. Connectivity patterns are connected to the one-side ends of wirings. A semiconductor chip(20) is arranged in the first area. It is arranged in a second part and a molding material(30) covers the semiconductor chip.;COPYRIGHT KIPO 2010