ELECTROLESS PLATING SOLUTION CAPABLE OF EFFICIENTLY CONTROLLING THE CORROSION OF A LOWER METAL LAYER DURING ELECTROLESS PLATING

摘要

PURPOSE: An electroless plating solution is provided to control the corrosion of a lower metal layer generated during electroless plating using a monomer of a conductive polymer.;CONSTITUTION: An electroless plating solution contains a plating solution and a conductive polymer. The plating solution includes metal salt. The conductive polymer is dissolved to the plating solution. The conductive polymer is selected from the group consisting of polyacetylene, polypyrrole, poly(3,4-ethylenedioxy thiophene), polyaniline, poly(o-methoxy aniline), poly(4,4-defen thoxy-2,2-bi thiophene), polythiophene, poly(3-methyl thiophene), poly(p-phenylenevinylene), and sulfonated polyaniline.;COPYRIGHT KIPO 2010