首页> 外国专利> PRINTED CIRCUIT BOARD FOR SOLID STATE RECORDER TELEMETRY DATA DRIVE WHICH RAPIDLY RELEASES HEAT CREATED FROM INTERNAL UNIT TO OUTSIDE BY FORMING THERMAL DISSIPATION PATTERN INSIDE THE PRINTED CIRCUIT BOARD CONNECTED TO HEAT GENERATION ELEMENT OF SOLID STATE RECORDER TELEMETRY DATA DRIVE

PRINTED CIRCUIT BOARD FOR SOLID STATE RECORDER TELEMETRY DATA DRIVE WHICH RAPIDLY RELEASES HEAT CREATED FROM INTERNAL UNIT TO OUTSIDE BY FORMING THERMAL DISSIPATION PATTERN INSIDE THE PRINTED CIRCUIT BOARD CONNECTED TO HEAT GENERATION ELEMENT OF SOLID STATE RECORDER TELEMETRY DATA DRIVE

机译:固态记录仪遥测数据驱动器的印刷电路板,通过在连接到固态记录的热生成元素的印刷电路板内部形成热耗散图样,将热量从内部单元迅速释放到内部

摘要

PURPOSE: By being efficiently proceed the radiant heat action without the separate apparatus like the cooling pen through the printed circuit board the printed circuit board for the solid state recorder telemetry data drive reduces the whole size of the solid state recorder telemetry data drive.;CONSTITUTION: A ground layer(130) is connected to the ground terminal of the semiconductor device mounted on the printed circuit board. A first thermal dissipation pattern(140) is connected to the ground layer. A first internal layer copper bump(150) is connected to the first thermal dissipation pattern. A Vcc layer(170) is connected to the Vcc terminal of the semiconductor device mounted on the printed circuit board. It is contiguous to the Vcc layer and the buffer layer is formed inside the printed circuit board.;COPYRIGHT KIPO 2010
机译:目的:通过有效地进行辐射热作用,而无需像冷却笔那样的单独装置通过印刷电路板,固态记录仪遥测数据驱动器的印刷电路板减小了固态记录仪遥测数据驱动器的整体尺寸。 :接地层(130)连接到安装在印刷电路板上的半导体器件的接地端子。第一散热图案(140)连接到接地层。第一内层铜凸块(150)连接到第一散热图案。 Vcc层(170)连接到安装在印刷电路板上的半导体器件的Vcc端子。它与Vcc层相邻,并且缓冲层形成在印刷电路板内部。; COPYRIGHT KIPO 2010

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号