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ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)

召开年：2007
召开地：Vancouver(CA)
出版时间：-

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1.CIRCUIT CONNECTION RELIABILITY ANALYSIS OF LASER-DRILLED BLIND VIA HOLES USING DATA-MINING METHOD

机译：激光挖孔玻璃孔的数据可靠度电路连接可靠性分析
- 作者：Keiji OGAWA;Toshiki HIROGAKI;Eiichi AOYAMA;Heisaburo NAKAGAWA
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
2.DIE STRESS VARIATION DURING THERMAL CYCLING RELIABILITY TESTS

机译：热循环可靠性测试中的模具应力变化
- 作者：M. Kaysar Rahim;Jordan Roberts;Jeffrey C. Suhling;Richard C. Jaeger;Pradeep Lall
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
3.STUDY OF PRINTED CIRCUIT BOARD SHOCK TRANSMISSIBILITY

机译：印刷电路板的冲击传递性研究
- 作者：Frank Fan Wang
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
4.SUBCOOLED POOL BOILING STUDIES ON NANO-TEXTURED SURFACES

机译：纳米纹理表面的过冷池沸腾研究
- 作者：Vijaykumar Sathyamurthi;Debjyoti;Banerjee
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
5.STUDY OF HORIZONTAL-BASE PIN-FIN HEAT SINKS IN NATURAL CONVECTION

机译：自然对流中水平基鳍鳍传热的研究
- 作者：D. Sahray;R. Magril;V. Dubovsky;G. Ziskind;R. Letan
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
6.THE ADIABATIC CONDITIONS ON INNER BOUNDARY FOR NATURAL CONVECTION WITH POROUS MEDIUM IN A NARROW HORIZONTAL CYLINDRICAL ANNULUS

机译：窄水平圆柱环中多孔介质自然对流内边界的绝热条件
- 作者：KAMYAR MANSOUR
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
7.TRANSIENT THERMAL CHARACTERIZATION OF ErAs/In_(0.53)GA_(0.47)AS THERMOELECTRIC MODULE

机译：ErAs / In_（0.53）GA_（0.47）AS热电偶态的瞬态热表征
- 作者：Y. Ezzahri;R. Singh;K. Fukutani;Z. Bian;A. Shakouri;G. Zeng;J. E. Bowers;J. M. Zide;A. C. Gossard
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
8.THE THERMAL-CIRCUIT HIGH-SPEED COLLABORATION LAYOUT DESIGN FOR AN ELECTRONIC SYSTEM WITH MULTI-AGENT METHOD

机译：电子系统的多代理热电学高速协同布局设计
- 作者：Shintaro Hayashi;Yoshiharu Iwata;Ryohei Satoh;Kozo Fujimoto
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
9.USING LINEAR SUPERPOSITION TO SOLVE MULTIPLE HEAT SOURCE TRANSIENT THERMAL PROBLEMS

机译：使用线性叠加解决多个热源瞬态热问题
- 作者：David T. Billings;Roger P. Stout
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
10.Heat Transfer Characteristics for a Confined Rotating MCM Disk with Round Jet Array Impingement

机译：具有圆形喷射阵列冲击的密闭旋转MCM盘的传热特性
- 作者：C. Y. Lee;C.J. Fang;C. H. Peng;T. W. Lin;Y. H.Hung
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
11.HERMETIC ENCAPSULATION TECHNIQUE DEVELOPED FOR THE IBM Z-SERVER MULTI-CHIP MODULE

机译：为IBM Z-SERVER多芯片模块开发的密闭封装技术
- 作者：Patrick A. Coico;Amilcar Arvelo;Gaetano P. Messina;Frank L. Pompeo;Donald W. Scheider
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
12.HIGH ACCURACY THERMAL ANALYSIS METHODOLOGY FOR SEMICONDUCTOR JUNCTION TEMPERATURES CONSIDERING LINE PATTERNS OF MULTILAYERED CIRCUIT BOARDS

机译：考虑多层电路板线型的半导体结温的高精度热分析方法
- 作者：Yutaka KUMANO;Tetsuyoshi OGURA;Toru YAMADA
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
13.HIGH COEFFICIENT OF PERFORMANCE QUANTUM WELL THERMOELECTRIC NANO COOLER

机译：高效能量子阱热电纳米冷却器
- 作者：Velimir Jovanovic;Saeid Ghamaty;Daniel Krommenhoek;John C. Bass
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
14.VAPOR EXTRACTION FROM FLOW BOILING IN A FRACTAL-LIKE BRANCHING HEAT SINK

机译：分形分支热沉中沸腾的蒸气提取
- 作者：Mario Apreotesi;Deborah Pence;James Liburdy
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
15.ZOOM-IN MODELING OF PACKAGES IN FORCED CONVECTION ELECTRONICS COOLING INCORPORATING A SUPERPOSITION APPROACH

机译：包含对位方法的强制对流电子冷却中的包装缩放模型
- 作者：Sriram Neelakantan;Bennett Joiner;Richard L. Scott
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
16.AREA-AVERAGED VOID FRACTION ANALYSIS OF FLOW BOILING IN A MICROSCALE BRANCHING CHANNEL NETWORK

机译：微型分支通道网络中沸腾的平均面积空隙率分析
- 作者：Douglas Heymann;Younghoon Kwak;Lee Edward;Vinod Narayanan;James Liburdy;Deborah Pence
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
17.SPATIAL FREQUENCY DOMAIN ANALYSIS OF HEAT TRANSFER IN MICROELECTRONIC CHIPS WITH APPLICATIONS TO TEMPERATURE AWARE COMPUTING

机译：微电子芯片传热的空间频率域分析及其在温度预警计算中的应用
- 作者：Keivan Etessam-Yazdani;Hendrik F. Hamann;Mehdi Asheghi
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
18.HEAT CONDUCTION IN PRINTED CIRCUIT BOARDS - PART Ⅱ; SMALL PCBs CONNECTED TO LARGE THERMAL MASS AT THEIR EDGE

机译：印刷电路板上的导热-第二部分;小型PCB在其边缘连接有较大的热质量
- 作者：Wataru Nakavama;Tatsuva Nakaiima;Hiroko Koike;Ryuichi Matsuki
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
19.TRANSIENT-RESPONSE SPECTRAL ANALYSIS BASED FEATURE EXTRACTION FOR BUILT-IN RELIABILITY TEST OF ELECTRONICS UNDER SHOCK LOADS

机译：瞬态响应谱分析基于特征提取的冲击载荷下电子可靠性测试
- 作者：Pradeep Lall;Prakriti Choudhary;Sameep Gupte;Prashant Gupta;Jeff Suhling;James Hofmeister
- 会议名称：《》 | 2007年
- time-Frequency analysis;
- ball-grid arrays;
- feature extraction;
- health monitoring;
- reliability;
20.CONTROL OF INSTABILITIES IN TWO-PHASE MICROCHANNEL FLOW USING ARTIFICIAL NUCLEATION SITES

机译：用人工核素控制两相微通道流动的不稳定性
- 作者：Rory J. Jones;Daniel T. Pate;Sushil H. Bhavnani
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
21.ANALYSIS AND PERFORMANCE COMPARISON OF COMPETING DESKTOP COOLING TECHNOLOGIES

机译：台式冷却技术的分析与性能比较
- 作者：Niru Kumari;Shankar Krishnan;Suresh V. Garimella
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
22.FAST AND ACCURATE SIMULATION OF HEAT TRANSFER IN MICROARCHITECTURES USING FREQUENCY DOMAIN TECHNIQUES

机译：利用频域技术快速，精确地模拟微结构中的传热
- 作者：Keivan Etessam-Yazdani;Hendrik F. Hamann;Mehdi Asheghi
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
23.CO-FLOWING AMMONIA DESORPTION IN A FRACTAL-LIKE BRANCHING HEAT EXCHANGER

机译：分形分支换热器中的共流氨解吸
- 作者：Greg Mouchka;Mario Apreotesi;Keith Davis;Deborah Pence
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
24.ENHANCED THERMOELECTRIC COOLER FOR ON-CHIP HOT SPOT COOLING

机译：片上热点冷却的增强型热电冷却器
- 作者：Peng Wang;Avram Bar-Cohen;Bao Yang
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
- thermoelectric cooer;
- mini-contact;
- Bi_2Te_3, onchip hot spot;
- thermal management;
- thermal contact resistance;
25.FORCED-CONVECTION BOILING CHARACTERISTICS BASED ON MASS AND ENERGY CONSERVATION

机译：基于质量和能量守恒的强制对流沸腾特性
- 作者：Kelsuke Horiuchi;Shigeo Ohashi
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
- boiling;
- heat transfer;
- evaporator;
- condenser;
- electronics cooling;
26.FREE-PISTON STIRLING COOLER FOR ELECTRONICS COOLING IN HIGH TEMPERATURE ENVIRONMENTS

机译：用于高温环境下电子冷却的自由活塞式搅拌冷却器
- 作者：Yong-Rak Kwon;David M Berchowitz
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
- free piston stirling cooler;
- FPSC;
- electronics cooling;
- active cooling;
27.HIGH TEMPERATURE LEAD-FREE ATTACH RELIABILITY

机译：高温无铅连接可靠性
- 作者：Patrick McCluskey;Pedro O. Quintero
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
28.SIMPLIFIED THERMAL MODEL OF SILICON THERMOELECTRIC MICROCOOLER FOR ON-CHIP HOT SPOT REMEDIATION

机译：硅热敏硅修复的简化热电模型
- 作者：Peng Wang;Avram Bar-Cohen
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
- silicon;
- thermoelectric cooler;
- on-chip hot spot;
- thermal management;
29.THERMOELECTRIC COOLER BASED REGENERATIVE ADSORPTION REFRIGERATION SYSTEM FOR HIGH TEMPERATURE ELECTRONICS

机译：基于热电冷却器的高温电子再生吸附制冷系统
- 作者：Ashish Sinha;Yogendra Joshi;Bruce H Storm
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年
30.VARIOUS LEVELS OF DROP ANALYSIS FOR BGA IN MOBILE PHONES

机译：移动电话中BGA的各种下降分析
- 作者：Takayoshi Katahira;Masato Fujita;Tsuyoki Shibata;Masaki Shiratori;Qiang Yu
- 会议名称：《ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007)》 | 2007年