WAFER-LEVEL PACKAGING IMAGE SENSOR MODULE AND A METHOD FOR MANUFACTURING THE SAME, CAPABLE OF MANUFACTURING THE IMAGE SENSOR MODULE WITH AN AUTO-FOCUSING FUNCTION

摘要

PURPOSE: A wafer-level packaging image sensor module and a method for manufacturing the same are provided to control the focus of the image sensor by including a lens driving unit with an electro-active polymer.;CONSTITUTION: An image sensor, a circuit unit, and a lower electrode are arranged on the upper side of a wafer(100). A lens driving unit(300) is formed on the upper side of the lower electrode and is composed of an electro-active polymer. An upper electrode(350) is formed on the upper side of the lens driving unit. A lens unit(500) is formed on the upper side of the upper electrode. An adhesive layer(400) is formed between the upper electrode and the lens unit.;COPYRIGHT KIPO 2010