首页> 外国专利> INTER-LAYER INSULATING FILM IN AN OXIDE CMP, CAPABLE OF ELIMINATING THE REWORK OF A CMP PROCESS, AND AN OXIDE CMP METHOD THEREOF

INTER-LAYER INSULATING FILM IN AN OXIDE CMP, CAPABLE OF ELIMINATING THE REWORK OF A CMP PROCESS, AND AN OXIDE CMP METHOD THEREOF

机译:能够消除CMP工艺返工的氧化物CMP中的层间绝缘膜及其氧化物CMP方法

摘要

PURPOSE: An inter-layer insulating film in an oxide CMP(Chemical Mechanical Polishing) and an oxide CMP method thereof are provided to easily and accurately detect a CMP endpoint by additionally depositing a CMP stopping film during forming an inter-layer insulating film.;CONSTITUTION: A first oxide film(11) is formed as much as a preset thickness on the upper part of a lower metal wiring. A stopping film(12) is used as the stopping film of a CMP process by being deposited on the first oxide film. A second oxide film(13) is removed with a CMP process by being deposited on the upper part of the stopping film. The first oxide film is thickly formed than a preset thickness. The stopping film is a polysilicon film or a nitride film.;COPYRIGHT KIPO 2010
机译:目的:提供一种氧化物CMP(化学机械抛光)中的层间绝缘膜及其氧化物CMP方法,以通过在形成层间绝缘膜的过程中另外沉积CMP停止膜来容易且准确地检测CMP终点。组成:第一氧化物膜(11)在下部金属布线的上部形成与预设厚度相同的厚度。停止膜(12)通过沉积在第一氧化物膜上而用作CMP工艺的停止膜。通过沉积在停止膜的上部上,通过CMP工艺去除第二氧化膜(13)。第一氧化物膜形成得比预定厚度厚。停止膜是多晶硅膜或氮化物膜。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100045060A

    专利类型

  • 公开/公告日2010-05-03

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080104089

  • 发明设计人 KIM HO YOUN;PARK KYUNG WOONG;

    申请日2008-10-23

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:54

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