首页> 外国专利> METHOD OF DETECTING A INNER TUBE PRESSURE OF POLISHING HEAD IN CHEMICLA MECHANICAL POLISHING DEVICE

METHOD OF DETECTING A INNER TUBE PRESSURE OF POLISHING HEAD IN CHEMICLA MECHANICAL POLISHING DEVICE

机译:检测化学机械抛光装置中抛光头内胎压力的方法

摘要

PURPOSE: the CMP devices that rubbing head CMP (chemically mechanical polishing) device of inner tube pressure detection method is provided for reducing unnecessary pause pass through detection pressure inner tube real-time informing exception. ;CONSTITUTION: a kind of pressure inner tube be measured by the following method in real time with inner tube pressure sensor (S210). Whether detection inner tube pressure determines it in the pressure limit of permission (S220). If whether the inner tube pressure detected is in the pressure limit of permission, indicator (S262) of the overpressure to outside display. If CMP processes are performed (S264) in the inner tube pressure allowed band detected. The inner tube pressure that detects simultaneously generates alarm signal in the pressure, stops (S270) with above-mentioned CMP processes. ;The 2010 of copyright KIPO submissions
机译:目的:提供了CMP装置,该装置提供了内胎压力检测方法的摩擦头CMP(化学机械抛光)装置,以减少不必要的暂停通过内胎压力的实时通知异常。 ;组成:用内管压力传感器(S210)通过以下方法实时测量一种内管压力。检测内管压力是否在允许的压力极限内确定(S220)。如果检测到的内胎压力是否在允许的压力极限内,则将过压指示器(S262)显示在外部显示器上。如果在检测到的内胎压力允许范围内执行了CMP处理(S264)。同时检测到的内胎压力在压力中生成警报信号,并通过上述CMP处理停止(S270)。 ; 2010年版权KIPO提交文件

著录项

  • 公开/公告号KR20100045093A

    专利类型

  • 公开/公告日2010-05-03

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080104138

  • 发明设计人 CHA HYUN KI;

    申请日2008-10-23

  • 分类号H01L21/66;H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:53

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