INDUCTIVELY COUPLED PLASMA APPARATUS WITH A STRUCTURE HOLDING DIELECTRIC, HAVING A SUPPORTING STRUCTURE HAVING A THIN DIELECTRIC SUBSTANCE

摘要

PURPOSE: An inductively coupled plasma apparatus with a structure holding dielectric is provided to generate uniform plasma while supporting a dielectric more stably by processing a substrate to be processed through an inductively-coupled plasma.;CONSTITUTION: A chamber(130) is divided into an antenna chamber and a substrate processing chamber by a dielectric. A gas supply unit supplies a processing gas to the substrate processing chamber. A discharging unit(150) exhausts the inside of the substrate processing chamber and maintains a reduced pressure state. A dielectric support structure(160) partitions the dielectric comprising the upper wall of a substrate process chamber into a plurality of partitions and maintains the inside of the substrate process chamber vacuum state. A high frequency antenna(170) is located in the antenna chamber and the top of the dielectric.;COPYRIGHT KIPO 2010