首页> 外国专利> WAFER TRANSPORTING SYSTEM, A SEMICONDUCTOR FABRICATION PLANT STRUCTURE USING THE SAME, AND A WAFER TRANSPORTING METHOD, CAPABLE OF MAXIMIZING INTEGRITY

WAFER TRANSPORTING SYSTEM, A SEMICONDUCTOR FABRICATION PLANT STRUCTURE USING THE SAME, AND A WAFER TRANSPORTING METHOD, CAPABLE OF MAXIMIZING INTEGRITY

机译:晶圆运输系统,使用该晶圆运输工厂的半导体制造厂结构以及一种晶圆运输方法,能够最大程度地提高集成度

摘要

PURPOSE: A wafer transporting system, a semiconductor fabrication plant structure using the same, and a wafer transporting method are provided to minimize a space for installing semiconductor manufacturing equipment by forming a three dimensional multi-storied structure of a semiconductor fabrication plant.;CONSTITUTION: A plurality of processing chamber modules(200) is formed on each layer of a multi-storied structure. An elevation channel(110) transfers vertically a wafer transferring box in which wafers are loaded. A semiconductor fabrication plant structure includes a wafer station(300) in order to load wafer cassettes into the wafer transferring box and unload the wafer cassettes from the wafer transferring box.;COPYRIGHT KIPO 2010
机译:目的:提供晶片输送系统,使用该晶片输送系统的半导体制造工厂结构以及晶片输送方法,以通过形成半导体制造工厂的三维多层结构来最小化用于安装半导体制造设备的空间。在多层结构的每一层上形成多个处理室模块(200)。升降通道(110)垂直地传送装载有晶片的晶片传送盒。半导体制造工厂结构包括晶片站(300),以将晶片盒装载到晶片传送盒中并从晶片传送盒中卸载晶片盒。COPYRIGHTKIPO 2010

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