首页> 外国专利> CONDUCTIVE ADHESIVE WITH THE IMPROVED ADHESIVE FORCE AND THE LOW FABRICATION COST, A MANUFACTURING METHOD THEREOF, AND AN ELECTRONIC DEVICE INCLUDING THEREOF

CONDUCTIVE ADHESIVE WITH THE IMPROVED ADHESIVE FORCE AND THE LOW FABRICATION COST, A MANUFACTURING METHOD THEREOF, AND AN ELECTRONIC DEVICE INCLUDING THEREOF

机译:具有改进的胶粘力和低制造成本的导电胶粘剂,其制造方法以及包括该胶粘剂的电子设备

摘要

PURPOSE: A conductive adhesive, a manufacturing method thereof, and an electronic device including thereof are provided to improve the electric conductivity by dispersing nanopowder among metal particles.;CONSTITUTION: A manufacturing method of a conductive adhesive comprises the following steps: adding more than one compound selected form the group consisting of hydrogenated cast oil, siloxane imide, liquid polybutadiene rubber, silica, and acrylate to a thermosetting resin, to reform the thermosetting resin; mixing the thermosetting resin with nanopowder including more than one element selected from the group consisting of metal powder, Ag, Cu, Al, Ni, expanded graphite, carbon nanotubes, carbon, and graphene; and dispersing the mixture.;COPYRIGHT KIPO 2011
机译:目的:提供一种导电胶,其制造方法以及包括该导电胶的电子设备,以通过将纳米粉末分散在金属颗粒中来提高导电性。组成:一种导电胶的制造方法包括以下步骤:添加多个选自氢化铸油,硅氧烷酰亚胺,液态聚丁二烯橡胶,二氧化硅和丙烯酸酯的化合物形成热固性树脂,以使热固性树脂重整。将热固性树脂与纳米粉末混合,该纳米粉末包括选自金属粉末,Ag,Cu,Al,Ni,膨胀石墨,碳纳米管,碳和石墨烯中的一种以上的元素。并分散混合物。; COPYRIGHT KIPO 2011

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号