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POLYIMIDE-BASED POLYMER CAPABLE OF FORMING A PHOTOSENSITIVE RESIN COMPOSITION FOR SEMICONDUCTOR BUFFER COATING, A COPOLYMER THEREOF, AND A POSITIVE TYPE PHOTORESIST RESIN COMPOSITION INCLUDING THEREOF
POLYIMIDE-BASED POLYMER CAPABLE OF FORMING A PHOTOSENSITIVE RESIN COMPOSITION FOR SEMICONDUCTOR BUFFER COATING, A COPOLYMER THEREOF, AND A POSITIVE TYPE PHOTORESIST RESIN COMPOSITION INCLUDING THEREOF
PURPOSE: A polyimide-based polymer, a copolymer thereof, and a positive type photoresist resin composition including thereof are provided to secure the proper solubility for an alkaline developing solution, and to secure the high definition of a photosensitive resin composition.;CONSTITUTION: A photosensitive polyimide-based polymer is a compound selected from the group consisting of compounds marked with chemical formula 1~3. In the chemical formulas, Z is a tetravalent organic group forming tetracarboxylic acid and its derivative, including 1~100mole% of 3,4-dicarboxy-1,2,3,4-tetrahydro-6-tertiary-butyl-1-naphthalene succinic dianhydride. Y2 is either a divalence aliphatic group or an aromatic organo group.;COPYRIGHT KIPO 2011
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机译：目的：提供一种聚酰亚胺基聚合物，其共聚物和包括其的正型光致抗蚀剂树脂组合物，以确保其对碱性显影液的适当溶解度，并确保高清晰度的光敏树脂组合物。感光性聚酰亚胺类聚合物是选自化学式为1〜3的化合物。在化学式中，Z为形成四羧酸及其衍生物的四价有机基团，包括1〜100mol％的3,4-二羧基-1,2,3,4-四氢-6-叔丁基-1-萘丁二酸二酐。 Y 2是二价脂族基团或芳族有机基团。; COPYRIGHT KIPO 2011
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