首页> 外国专利> HIGH-PURITY HAFNIUM, TARGET AND THIN FILM COMPRISING HIGH-PURITY HAFNIUM, AND PROCESS FOR PRODUCING HIGH-PURITY HAFNIUM

HIGH-PURITY HAFNIUM, TARGET AND THIN FILM COMPRISING HIGH-PURITY HAFNIUM, AND PROCESS FOR PRODUCING HIGH-PURITY HAFNIUM

机译:高纯HA,包含高纯HA的靶标和薄膜以及生产高纯HA的方法

摘要

using a hafnium sponge with reduced zirconium as the raw material , and also it contained in the hafnium Fe, Cr, Ni of impurities , Ca, Na, K impurities , Al, Co, Cu, Ti, W, Zn impurities , and the line count number , U, Th impurities , Pb, Bi impurities , and the amount of the gas component C , with respect to the manufacturing method of high purity hafnium were each reduced, and effective and reliable manufacturing techniques, and also provides a high purity hafnium material , the target , and the gate insulating film or a metal gate thin film formed by sputtering for the material obtained by it . ; a Zr and gas components , except for at least 6N purity , Fe, Cr, Ni , respectively below 0.2ppm, Ca, Na, K are each less than 0.1ppm, Al, Co, Cu, Ti, W, Zn is 0.1 High purity hafnium , characterized in that not more than ppm.
机译:以还原锆的sponge海绵为原料,并在the中含有Fe,Cr,Ni杂质,Ca,Na,K杂质,Al,Co,Cu,Ti,W,Zn杂质,相对于高纯度ha的制造方法,可减少计数数量,U,Th杂质,Pb,Bi杂质和气体组分C的量,从而有效而可靠地制造技术,还提供了高纯度purity材料,靶材,以及通过溅射形成的材料的溅射形成的栅绝缘膜或金属栅薄膜。 ; a Zr和气体成分(纯度至少为6N除外),Fe,Cr,Ni分别低于0.2ppm,Ca,Na,K均低于0.1ppm,Al,Co,Cu,Ti,W,Zn为0.1高纯度ha,特征在于不超过ppm。

著录项

  • 公开/公告号KR100968396B1

    专利类型

  • 公开/公告日2010-07-07

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20087000215

  • 发明设计人 신도 유이치로;

    申请日2006-06-12

  • 分类号C23C14/34;C22C38/00;C22B9/22;B22D27/02;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:05

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