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High-purity hafnium, target and thin film comprising high-purity hafnium, and process for producing high-purity hafnium

机译:高纯ha,包含高纯ha的靶材和薄膜以及生产高纯ha的方法

摘要

Provided is a method of manufacturing high-purity hafnium by using a hafnium sponge with reduced zirconium as the raw material in which the impurity content of Fe, Cr, and Ni, the impurity content of Ca, Na, and K, the impurity content of Al, Co, Cu, Ti, W, and Zn, the alpha dose, the impurity content of U and Th, the impurity content of Pb and Bi, and the content of C as a gas component contained in the hafnium are reduced. Based on this efficient and stable manufacturing technology, additionally provided are a high-purity hafnium material obtained from the foregoing high-purity hafnium, as well as a sputtering target, a gate insulation film and a metal gate thin film, which are formed from this material. This high-purity hafnium has a purity 6N or higher except Zr and gas components, wherein Fe, Cr and Ni are respectively 0.2 ppm or less, Ca, Na and K are respectively 0.1 ppm or less, and Al, Co, Cu, Ti, W and Zn are respectively 0.1 ppm or less.
机译:提供了一种以还原锆的ir海绵为原料制造高纯度ha的方法,其中Fe,Cr和Ni的杂质含量,Ca,Na和K的杂质含量,Ca,Na和K的杂质含量。减少了Al,Co,Cu,Ti,W和Zn,α剂量,U和Th的杂质含量,Pb和Bi的杂质含量以及as中作为气体成分的C的含量。基于这种有效且稳定的制造技术,还提供了由上述高纯度ha获得的高纯度ha材料,以及由此形成的溅射靶,栅极绝缘膜和金属栅极薄膜。材料。该高纯度ha除了Zr和气体成分之外,其纯度为6N以上,其中Fe,Cr和Ni分别为0.2ppm以下,Ca,Na和K分别为0.1ppm以下,以及Al,Co,Cu,Ti ,W和Zn分别为0.1ppm以下。

著录项

  • 公开/公告号US8277723B2

    专利类型

  • 公开/公告日2012-10-02

    原文格式PDF

  • 申请/专利权人 YUICHIRO SHINDO;

    申请/专利号US20060994167

  • 发明设计人 YUICHIRO SHINDO;

    申请日2006-06-12

  • 分类号C22C27/00;C23C14/34;C25C5/00;

  • 国家 US

  • 入库时间 2022-08-21 17:29:28

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