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SUBSTRATE FOR ELECTRONIC COMPONENT HAVING ELECTROLESS PLATING, AND PROCESS FOR PRODUCTION OF SUBSTRATE FOR ELECTRONIC COMPONENT
SUBSTRATE FOR ELECTRONIC COMPONENT HAVING ELECTROLESS PLATING, AND PROCESS FOR PRODUCTION OF SUBSTRATE FOR ELECTRONIC COMPONENT
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机译:具有无电镀层的电子成分用基质以及生产电子成分用基质的方法
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摘要
There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.
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