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RESIN SUBSTRATE, SUBSTRATE FOR ELECTRONIC COMPONENT HAVING ELECTROLESS PLATING APPLIED THEREON, AND PROCESS FOR PRODUCTION OF SUBSTRATE FOR ELECTRONIC COMPONENT
RESIN SUBSTRATE, SUBSTRATE FOR ELECTRONIC COMPONENT HAVING ELECTROLESS PLATING APPLIED THEREON, AND PROCESS FOR PRODUCTION OF SUBSTRATE FOR ELECTRONIC COMPONENT
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机译:树脂基质,用于其上的具有无电电镀的电子成分用基质,以及用于电子成分的基质的生产方法
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摘要
Disclosed is a technique which is applicable to a resin substrate typically used as a substrate and can improve the adherability between the substrate and a metal-plated layer, that is, a resin substrate for general use which has an improved adherability against a metal-plated layer. A resin substrate comprising, for example, an epoxy resin, prepared by treating its surface which has swellability with a solution containing imidazolesilane and a compound of a noble metal (e.g., palladium) which has a catalytic effect on electroless plating. A substrate for an electronic component, comprising the resin substrate having electroless plating applied thereon.;COPYRIGHT KIPO & WIPO 2010
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