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High‐Volume Processed ITO‐Free Superstrates and Substrates for Roll‐to‐Roll Development of Organic Electronics

机译:大批量加工无ITO的基板和用于有机电子滚动开发的基板

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摘要

The fabrication of substrates and superstrates prepared by scalable roll‐to‐roll methods is reviewed. The substrates and superstrates that act as the flexible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the field of organic electronics. The initial development of the replacement of indium‐tin‐oxide (ITO) for the flexible carrier materials is described and a description of how roll‐to‐roll processing development led to simplification from an initially complex make‐up to higher performing materials through a more simple process is also presented. This process intensification through process simplification is viewed as a central strategy for upscaling, increasing throughput, performance, and cost reduction.
机译:审查了用可伸缩卷对卷方法制备的基板和上层基板的制造。用作功能性有机电子器件加工的柔性载体的基板和上层板是必不可少的组件,并提出了有关如何需要各种形式的这些材料的一般可用性以加速有机电子领域发展的建议。 。本文介绍了用柔性载体材料代替氧化铟锡(ITO)的初步开发,并描述了卷对卷加工的发展如何通过从一开始就简化了从最初的复杂构成到更高性能的材料的过程。还介绍了更简单的过程。通过简化流程来增强流程被视为升级,增加吞吐量,性能和降低成本的主要策略。

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