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Insulated Heat Sink Power Quad Flat No-Lead Semiconductor Chip Packages for high voltage, high power applications, systems for using them, and methods of making same
Insulated Heat Sink Power Quad Flat No-Lead Semiconductor Chip Packages for high voltage, high power applications, systems for using them, and methods of making same
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机译:用于高压,高功率应用的绝缘散热器功率四方扁平无铅半导体芯片封装,使用它们的系统及其制造方法
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摘要
Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member disposed on the semiconductor die and the leadframe and integrated into the molding material of the package. The heat sink member has an electrically insulating substrate with a high breakdown voltage, and one or more conductive layers disposed on a first surface of the substrate that electrically interconnect the semiconductor to one or more leads of the leadframe.
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