Half conductor component module with a stack of semiconductor components, wherein each semiconductor device having at least one semiconductor chip (41) in a housing (21) is arranged, wherein the housing (21) contains a plastic housing material (34) and the plastic housing material (34) an upper external contact (11) on its upper side (7) and a lower external contact (12) on its underside (9), wherein the upper external contact (11) with the lower external contact (12) electrically by means of a conductive path (18) is connected, and wherein the plastic housing material (34) consists of a mixture of a plastic (32) with filler particles (25), and the conduction path (18) of exposed conducting metallic deposits (17) is formed and the filler particles (25) with organometallic compounds or inorganic complex compounds are provided.
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