Integrated circuit device i.e. integrated circuit chip, has connection network with front electrical connection tracks or lines formed in last metallic track and distance from front exterior electrical connection pads of connection units

摘要

The device (1) has active parts (3n) e.g. electronic components, with electrical contacts (4n), and electrical connection units (5) formed above the active parts in metallic paths (Mn). The connection units are connected by interconnecting vias (9n) and include front exterior electrical connection pads (6n) formed in a last metallic path (Md). The units include an electrical connection network (7) selectively connecting the contacts and the pads. The network includes front electrical connection tracks or lines (10n) formed in the last track and distance from the pads.