The Effect of Structural Parameters on Electrical Resitance of Microcontact Connections in Integrated Circuits

机译：集成电路中微接触连接电阻的结构参数的影响

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The mathematical equations for analysis of dependence of electric resistance of microcontact connection (MCC) on its dimension and intermediate resistance are considered. The computation software is designed. It is established that in proposed model the w

机译：考虑了用于分析微接触连接（MCC）的电阻与其尺寸和中间电阻的关系的数学方程式。设计了计算软件。确定在提出的模型中

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来源
《Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2006 Proceedings of International Conference on》|2006年|P.619|共1页
会议地点 LvivUkraine
作者
Smerklo; L.; Dyachok; D.; Hladun; M.;
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contact resistance; integrated circuit interconnections; integrated circuits; computation software; contact resistance; electric resistance; electrical resitance; integrated circuits; mathematical equations; microcontact connections; structural parameters; contact;

机译：接触电阻集成电路互连；集成电路;计算软件；接触电阻电阻电阻集成电路;数学方程微接触连接；结构参数联系;

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The Effect of Structural Parameters on Electrical Resitance of Microcontact Connections in Integrated Circuits

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