Microcircuit card i.e. integrated circuit chip card, has connection wire connected to back of side pad for conveying electric signal associated with side pad that is electrically connected with central pad

摘要

The card has a vignette (10) including a dielectric support whose face supports side contact pads that are arranged in two rows separated by a central contact pad. A microcircuit (20) is adhered at the back of the central pad. Each side pad receives determined electric signal in a receiving zone, where the signal is transferred to a contact stud corresponding to an active face of the microcircuit via a connection wire. The connection wire is connected to the back of one of the side pads for conveying the electric signal associated with the side pad electrically connected with the central pad. An independent claim is also included for a method for counter-measurement of attacks, by light radiation, on a rear face of a microcircuit card.