首页> 外国专利> DEVICE FOR DETECTING CRACK OF WAFER, METHOD OF DETECTING THE CRACK, DEVICE AND METHOD FOR MANUFACTURING SOLAR CELL OR SEMICONDUCTOR ELEMENT, AND SOLAR CELL OR SEMICONDUCTOR ELEMENT

DEVICE FOR DETECTING CRACK OF WAFER, METHOD OF DETECTING THE CRACK, DEVICE AND METHOD FOR MANUFACTURING SOLAR CELL OR SEMICONDUCTOR ELEMENT, AND SOLAR CELL OR SEMICONDUCTOR ELEMENT

机译:用于检测晶片裂纹的装置,检测裂纹的方法,用于制造太阳能电池或半导体元件的装置和方法,以及太阳能电池或半导体元件

摘要

PROBLEM TO BE SOLVED: To provide a device for detecting cracks, capable of reliably detecting the cracks of a wafer.;SOLUTION: The device for detecting the cracks is configured such that a wafer 13 is positioned and held by being sandwiched between a pillar member 11 and an audio sensor 15 by interposing an elastic material; in this sandwiched state, a vibration part 19 coated with an elastic material 22 is made to collide with the wafer 13 and vibrated; vibration waveform transmitted to the wafer 13 then is detected by the audio sensor 15; and the cracks are detected based on a frequency component higher than the resonant frequency of the vibration waveform.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种能够可靠地检测晶片的裂缝的裂缝检测装置。解决方案:裂缝的检测装置被构造为通过夹在支柱构件之间来定位并保持晶片13。 11和音频传感器15通过插入弹性材料;在该夹持状态下,使覆盖有弹性材料22的振动部19与晶片13碰撞而振动。然后,由声音传感器15检测传递到晶片13的振动波形。并根据高于振动波形共振频率的频率分量检测出裂纹。; COPYRIGHT:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2011205084A

    专利类型

  • 公开/公告日2011-10-13

    原文格式PDF

  • 申请/专利权人 NF CORP;

    申请/专利号JP20110044374

  • 发明设计人 KUROSAWA RAKU;

    申请日2011-03-01

  • 分类号H01L21/66;H01L31/04;G01N29/12;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:52

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