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SOLDER PASTE HAVING BLACKENING PREVENTIVE EFFECT, AND LEAD-FREE SOLDER BLACKENING PREVENTIVE METHOD

机译:具有防黑化作用的焊锡膏和无铅防黑化作用的方法

摘要

PROBLEM TO BE SOLVED: To solve a problem that if resin-based flux containing organic halide is contained in a lead-free solder employed through lead-free solder, a soldered portion is secularly discolored black and advanced to the inside of the solder, resulting in separation of the soldered portion or degradation of the conductivity of the solder.;SOLUTION: When using flux containing organic halide in soldering a lead-free solder, phosphor compound is added to the flux containing the organic halide, or phosphor is added to lead-free solder powder to be used, and the reaction of halogen remaining in flux residue after the soldering can be suppressed thereby.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:为了解决以下问题:如果在通过无铅焊料使用的无铅焊料中包含含有有机卤化物的树脂基助焊剂,则焊接部分会长期变色为黑色,并前进到焊料内部,从而导致解决方案:在使用含有机卤化物的助焊剂焊接无铅焊料时,将磷化合物添加到含有机卤化物的助焊剂中,或将磷添加到铅中使用无铅焊料粉,从而可以抑制焊接后残留在助焊剂残留物中的卤素的反应。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011115855A

    专利类型

  • 公开/公告日2011-06-16

    原文格式PDF

  • 申请/专利权人 SENJU METAL IND CO LTD;

    申请/专利号JP20110005551

  • 发明设计人 TAKAGI YOSHINORI;UEJIMA MINORU;

    申请日2011-01-14

  • 分类号B23K35/363;B23K35/26;B23K35/30;B23K35/22;C22C13/00;C22C5/06;C22C9/00;C22C12/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:37

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