SEMICONDUCTOR SUBSTRATE HEAT TREATMENT APPARATUS AND TEMPERATURE ESTIMATING METHOD BY THE SEMICONDUCTOR SUBSTRATE HEAT TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate heat treatment apparatus which can control a temperature distribution of a susceptor disposed by lamination even when a horizontal magnetic flux is provided to the susceptor, and can carry out heat treatment by batch processing.;SOLUTION: In the heat treatment apparatus 10 which indirectly heats a wafer 23 mounted on a susceptor 18 disposed horizontally, the apparatus 10 has an induction heating coil 26 which is disposed on the outer peripheral side of the susceptor 18 to form an AC magnetic flux in a direction parallel to a heating object mounting face in the susceptor 18. The susceptor 18 is provided in a plurality of layers in a vertical direction, a plurality of induction heating coils 26 are disposed adjacently and vertically along the susceptor 18 provided in the vertical direction, and a central temperature sensor 47a and a felly temperature sensor 47b are provided in susceptors 18b and 18c which are induction-heated between the induction heating coils 26 adjacent in the vertical direction.;COPYRIGHT: (C)2011,JPO&INPIT