首页> 外国专利> THERMAL STRESS CRACKING FOR BRITTLE MATERIAL BY WIDE REGION NON-UNIFORM TEMPERATURE DISTRIBUTION

THERMAL STRESS CRACKING FOR BRITTLE MATERIAL BY WIDE REGION NON-UNIFORM TEMPERATURE DISTRIBUTION

机译:整个区域非均匀温度分布的脆性材料热应力开裂

摘要

PPROBLEM TO BE SOLVED: To provide a method and a device which achieve both of high cracking speed and high cracking position precision without generating thermal damage on a workpiece by the heating of a material in high quality thermal stress cracking for a brittle material which does not generate cullets and microcracks which have been inevitable in the conventional mechanical scribing method. PSOLUTION: In a region wide as much as possible on a workpiece, a non-uniform heating temperature distribution of relatively low temperature which is slowly distributed is provided so as to reduce heating temperature for generating stress, and the thermal damage of the workpiece is prevented. Besides, heating energy concentrated on a relatively micro region as a cracking position decision factor is superimposed on the heating temperature distribution, also, the position is off-set, or negative feedback control is performed, and further, if required, positive feedback control is performed so as to improve cracking position precision. As the heating laser, a COSB2/SBlaser, an Er:YAG laser capable of achieving full-cuts or an FeSP+2/SP:ZnSe laser capable of selectively achieving full-cuts and extremely deep scribes at various sheet thicknesses is used. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:提供一种实现高破裂速度和高破裂位置精度的方法和装置,而不会因在脆性材料的高质量热应力破裂中加热材料而在工件上产生热损伤。不会产生传统机械刻划方法不可避免的碎玻璃和微裂纹。

解决方案:在工件上尽可能宽的区域中,提供了一个相对较低温度的缓慢均匀分布的加热温度分布,该分布缓慢分布,从而降低了产生应力的加热温度,从而降低了工件的热损伤。防止工件。此外,将集中在作为裂纹位置决定因素的相对微小区域上的加热能量叠加在加热温度分布上,并且将该位置偏移或进行负反馈控制,并且,如果需要,则进行正反馈控制。以提高裂纹位置精度。作为加热激光器,可以使用CO 2 激光器,可以实现全切割的Er:YAG激光器或可以选择性地实现全切割的Fe +2 :ZnSe激光器。并使用各种厚度的极深划线。

版权:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010264471A

    专利类型

  • 公开/公告日2010-11-25

    原文格式PDF

  • 申请/专利权人 KARUBE NORIO;

    申请/专利号JP20090117141

  • 发明设计人 KARUBE NORIO;KARUBE MITSUJIRO;

    申请日2009-05-14

  • 分类号B23K26/073;B28D5;B23K26/38;B23K26/40;C03B33/09;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:56

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