METHOD FOR CUTTING SAPPHIRE SINGLE CRYSTAL BY WIRE SAW AND SINGLE CRYSTAL SAPPHIRE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for cutting a sapphire single crystal by a wire saw suitable at the time of production of a single crystal sapphire substrate wherein a surface warp shape is isotropically a recessed surface, and the single crystal sapphire substrate.;SOLUTION: A plurality of respective wires 10 provided between at least two rotary rollers A and B in parallel under tension at a predetermined interval are allowed to unidirectionally or reciprocally run while the wire row comprising a plurality of the wires 10 is relatively pressed to the sapphire single crystal 20 having a columnar shape or almost columnar shape and rotated centering around the center axis in the longitudinal direction thereof to cut the sapphire single crystal 20 to thereby obtain a plurality of sapphire single crystal wafers. In this method for cutting the sapphire single crystal 20 by the wire saw, the number of rotations of the sapphire single crystal 20 is set to 15-150 rpm under a condition that the linear velocity of the wires is 300-500 m/min.;COPYRIGHT: (C)2011,JPO&INPIT