AlN sintered body and the AlN circuit board using the same

摘要

PROBLEM TO BE SOLVED: To provide an AlN sintered compound with high heat radiation property and high strength, and an AlN circuit substrate excellent in high bonding strength between the AlN substrate and the metal circuit part, and a thermal cycle resistance property by improving a polishing property of the AlN substrate.;SOLUTION: The sintered compact is characterized in that the number of AlN crystal contained in 50 μm straight line distance is 15-30, and the heat conductivity is 200 W/(m.k) or more.;COPYRIGHT: (C)2002,JPO