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The light-emitting diode metal make package which uses the light-emitting diode metal make housing and the metal make housing of press forging system

机译:使用发光二极管金属外壳和冲压锻造系统的金属外壳的发光二极管金属外壳

摘要

As for the light-emitting diode metal make package which uses the light-emitting diode metal make housing and the metal make housing which are produced with the press forging system due to this invention, the light-emitting diode of one or more (LED: LIGHT EMITTING DIODE) the reflected sudden section which is formed outside the tip/chip applied part in the surface of the housing body and the aforementioned housing body which are installed in the tip/chip applied part where the tip/chip was formed to the surface central part is formed as one unit, but forming the housing body and the reflected sudden section which the description above as one unit are formed with the metal material, it is something which becomes. As for this invention, the light-emitting diode of one or more (LED: LIGHT EMITTING DIODE) the housing body and reflected sudden section where the tip/chip is installed by forming in the metal make, the light-emitting diode housing cubic measure (size) to be able standardize uniformly by the fact that the light-emitting diode housing is standardized, the light-emitting diode tip/chip our (automatic installation) to do, to be possible being automatic, to connect the electrode line to the light-emitting diode tip/chip and between the terminals, in addition, being automatic, install the external terminal to be able, the resin (with the casting resin or silicon) to be possible, to raise the consecutive process automated availability which is applied thereforeIt is possible to retrench prime cost, by raising productivity raising the luminous intensity of the reflecting interface by forming the housing and the reflected sudden section in the metal make, because improving the brightness of the optical element package not only as little as possible, it becomes the metallic materials, brightness decrease does not occur, it is possible to utilize the light which occurs from the light-emitting diode efficiently. Selective figure Figure 1
机译:使用根据本发明的利用压力锻造系统制造的发光二极管金属外壳和金属外壳的发光二极管金属外壳,一个或多个发光二极管(LED:发光二极管)在外壳体的表面中的尖端/切屑施加部的外侧形成的反射突波部,以及安装在形成有尖端/切屑的表面的尖端/切屑施加部的上述壳体。中央部分形成为一个单元,但是,将上述的描述由金属材料形成为一个单元,而形成壳体和反射的突然截面。对于本发明,通过在金属外壳上形成一个或多个外壳体和安装有尖端/芯片的反射突变部分(LED:LIGHT EMITTING DIODE),该发光二极管外壳为立方尺寸。 (尺寸)可以通过发光二极管外壳的标准化来统一标准化,我们的发光二极管尖端/芯片(自动安装)可以自动地将电极线连接到发光二极管的尖端/芯片以及端子之间,此外,是自动的,因此可以安装外部端子,使树脂(与浇铸树脂或硅)成为可能,以提高所应用的连续工艺的自动化可用性因此,通过提高生产率,可以通过提高生产率,通过在金属制品中形成外壳和反射的突然截面来提高反射界面的发光强度,从而降低主要成本,这是因为可以提高金属丝的亮度。光学元件封装不仅尽可能少,而且成为金属材料,不会发生亮度下降,并且可以有效地利用从发光二极管发出的光。<选择图>图1

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