LIGHT-EMITTING DIODE PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME EMPLOYING A MASK TO FORM A METAL COATING ON A REFLECTIVE SIDE SURFACE OF THE LIGHT-EMITTING DIODE PACKAGE SUBSTRATE

摘要

According to the present invention, a light-emitting diode package substrate is manufactured by: positioning a multiuse mask having a three-dimensional structure, defining a through-hole corresponding to a light reflective surface region inside an opening for mounting a light-emitting diode chip of a package substrate, on said package substrate; and coating a metal material on the light reflective surface region with a predetermined coating technique to form a reflective metal surface.