The tip/chip die electronic parts enclosing mount, production manner of the tip/chip die electronic parts enclosing mount form backing material, and being the tip/chip die electronic parts enclosing mount where it can provide

摘要

PPROBLEM TO BE SOLVED: To provide a paper base material for a storing mount, and a storing mount in which releasing in a paper layer or releasing between paper layers can be prevented, and surface layer crimps are hardly formed when bending stress is exerted thereon. PSOLUTION: In the chip-like electronic component storing mount, a recessed part or a punched part for storing a chip-like electronic component is formed on a paper base material. The freeness, the water retention, the weight weighted mean fiber length and the fiber length distribution coefficient of maceration pulp obtained by maceration by a pulp maceration method specified in JIS P 8220 are within a specified range. PCOPYRIGHT: (C)2007,JPO&INPIT